Process for manufacturing integrated circuits using an automated

Details Process for manufacturing integrated circuits using an automated Process for manufacturing integrated circuits using an automated

1993-04-13

1996-08-27

Wilczewski, Mary

Metal working

Barrier layer or semiconductor device making

437 7, 437207, 437926, 156 64, H01L 2158, H01L 2160, H01L 2171

Patent

active

055497160

ABSTRACT:
A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding for adhesively mounting IC chips on a lead frame, wire-bonding for connecting bonding pads of the IC chips and the lead frame to each other through lead wires, and molding for forming a resin material into an outer package for covering each of the IC chips are successively executed on a through-line while transferring the lead frame by means of a conveyor.

REFERENCES:
patent: 3649354 (1972-03-01), Te Velde
patent: 4173821 (1979-11-01), Yamamoto et al.
patent: 4209898 (1980-07-01), Aoki et al.
patent: 4283847 (1981-08-01), May
patent: 4292116 (1981-09-01), Takahashi et al.
patent: 4301958 (1981-11-01), Hatakenaka et al.
patent: 4493939 (1985-01-01), Blaske et al.
patent: 4619043 (1986-10-01), Takahashi et al.
patent: 4805110 (1989-02-01), Takahashi et al.
patent: 4817849 (1989-04-01), Yamamoto et al.
patent: 4850103 (1989-07-01), Takemoto et al.
patent: 4851902 (1989-07-01), Tezuka et al.
patent: 4910866 (1990-03-01), Allen
patent: 4941255 (1990-07-01), Bull
patent: 5023202 (1991-06-01), Long et al.
patent: 5113565 (1992-05-01), Cipolla et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5187123 (1993-02-01), Yoshida et al.

Affiliated with

Also associated with

Rating

Process for manufacturing integrated circuits using an automated does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing integrated circuits using an automated, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing integrated circuits using an automated will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1053427