Chemistry: electrical and wave energy – Processes and products
Patent
1982-06-29
1985-07-09
Tufariello, Thomas
Chemistry: electrical and wave energy
Processes and products
427 96, C25D 502, C25D 534, C25D 550
Patent
active
045280720
ABSTRACT:
A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates, superposed upon each other with a predetermined space therebetween. Each of the substrate has a signal conductor pattern formed on at least one surface thereof and a land conductor pattern formed on at least one surface thereof. Each substrate has plated through holes in the land conductor pattern, each of which holes is in line with another plated through hole of at least one of the neighboring substrates to form a continuous through hole or an interstitial through hole. A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plated through holes. This layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates. The superposed substrates, except for at least one surface substrate, are made of a thermally resistant organic synthetic resin sheet or an insulation-treated metal.
REFERENCES:
patent: 2872391 (1959-02-01), Hauser et al.
patent: 3208921 (1965-09-01), Hill
patent: 3365620 (1968-01-01), Butler et al.
patent: 3436819 (1969-04-01), Lunine
patent: 3568000 (1971-03-01), D'Aboville
patent: 3616532 (1970-02-01), Beck
patent: 3648131 (1972-03-01), Stuby
patent: 3739469 (1973-06-01), Dougherty, Jr.
patent: 3745095 (1973-07-01), Chadwick et al.
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 3829601 (1974-08-01), Jeannotte et al.
patent: 3890177 (1975-06-01), Pfahnl et al.
patent: 4088545 (1978-05-01), Supnet
patent: 4135988 (1979-01-01), Dugan et al.
patent: 4285780 (1981-08-01), Schachter
patent: 4312897 (1982-01-01), Reimann
patent: 4368503 (1983-01-01), Kurosawa
Imura Takayoshi
Kurosawa Keiji
Mitsui Hisami
Miyabara Ayako
Miyagawa Kiyotaka
Fujitsu Limited
Tufariello Thomas
LandOfFree
Process for manufacturing hollow multilayer printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for manufacturing hollow multilayer printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing hollow multilayer printed wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-908077