Process for manufacturing electroformed patterns

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156235, 156249, 205 67, 205 72, C25D 100

Patent

active

058912851

ABSTRACT:
A process for manufacturing electroformed patterns includes the following steps: forming electroformed closed line graphic patterns and an electroformed line surrounding said patterns (optionally together with an electroformed island) on a surface of a conductive substrate; peeling the electroformed patterns and the electroformed line (optionally together with the electroformed island) from the conductive substrate to transfer them onto a pressure-sensitive adhesive layer provided on a support; injecting or printing a coating material inside the closed line graphic electroformed patterns and converting the coating material to coating films; forming a firmly bonding adhesive layer on a whole surface of the support on its side where the electroformed patterns, the coating films and the electroformed line (optionally together with the electroformed island) are retained; removing the electroformed line (optionally together with the electroformed island); separating the electroformed patterns and the coating films from the support and, simultaneously therewith, adhering the electroformed patterns and coating films through the firmly bonding adhesive layer onto a surface of an adherend. This process enables simple formation of electroformed patterns provided with coating films which may be a luminous paint, and is suitable for making a timepiece face.

REFERENCES:
patent: 4462873 (1984-07-01), Watanabe
patent: 4584039 (1986-04-01), Shea
patent: 4869760 (1989-09-01), Matsunami
patent: 5501785 (1996-03-01), Nakayama

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