Process for manufacturing electroformed patterns

Details Process for manufacturing electroformed patterns Process for manufacturing electroformed patterns

1995-01-17

1996-03-26

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

205 72, C25D 100

Patent

active

055017851

ABSTRACT:
The process for manufacturing electroformed patterns according to the present invention comprises: forming electroformed patterns and an electroformed line surrounding said patterns (and optionally an electroformed island) on a surface of a conductive substrate; peeling the electroformed patterns and the electroformed line (and optionally an electroformed island) from the conductive substrate to transfer them onto a pressure-sensitive adhesive layer provided on a support; forming a firmly bonding adhesive layer on the whole surface of the side where the electroformed patterns and the electroformed line (and optionally an electroformed island) are retained; removing the electroformed line (and optionally an electroformed island); and adhering the electroformed patterns to a surface of an adherend through the firmly bonding adhesive layer, simultaneously with separating the electroformed patterns from the support. According to this invention, the electroformed patterns can be manufactured at a low cost. Further, the electroformed patterns can be easily separated from the support when the patterns are adhered to the adherend. Moreover, protrusion of the adhesive after adhering the electroformed patterns to the adherend can be inhibited. Still more, the formation of pinhole-like small electroformed products can be inhibited.

REFERENCES:
patent: 4462873 (1984-07-01), Watanabe
patent: 4584039 (1986-04-01), Shea

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