Process for manufacturing copper-clad laminate

Details Process for manufacturing copper-clad laminate Process for manufacturing copper-clad laminate

1983-07-08

1984-02-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562748, 1562757, 156629, 156666, 2041291, C23F 100, B44C 122, B29C 1904, C03C 1500

Patent

active

044340222

ABSTRACT:
A process for manufacturing a copper-clad laminate which includes a rolled copper foil as a circuit conductive material comprising, introducing a rolled copper foil through a power supply/guide roller into an electrolyte so as to pass between two parallel electrodes which are disposed in the electrolyte. An AC, DC or a combination thereof is supplied to the power supply/guide roller and the electrodes to form an etched layer on either one or both sides of the rolled copper foil. An adhesive is applied to the etched layer and the resultant rolled copper foil is pressed with a substrate made of a synthetic resin put together to form a laminate.

REFERENCES:
patent: 1954403 (1934-04-01), Daly
patent: 2313422 (1943-03-01), Dimon
patent: 3779877 (1973-12-01), Alwitt
patent: 3876479 (1975-04-01), Yamada

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