Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
1998-08-18
2001-10-02
Picardat, Kevin M. (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S106000, C438S116000, C257S679000
Reexamination Certificate
active
06297077
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to a process for manufacturing chip cards.
BACKGROUND OF THE INVENTION
A process and device for the manufacture of chip cards is disclosed in WO 92/20506 A1, according to which a chip card is manufactured of one single plastic material. A form tool is used to embrace a form tool component, which is movable in a transverse direction of the mold space in such a manner that the mold space can be reduced to imbed a chip module into the card body after the plastic material is injected into the mold space. By means of a punching tool which is movable in a transverse direction, a mini chip card imbedded in the card body is produced, forming a punching gap at the same time. The disadvantage of this known process is that the material characteristics of the plastic material are decisive for the strain on the card body on the one hand and the mini chip on the other hand.
SUMMARY OF THE INVENTION
Briefly, the present invention comprises, in one embodiment, a process to manufacture a chip card by injecting a molten plastic material into a mold and subsequently cooling down the plastic material, comprising the steps of: injecting a first plastic material into a first mold compartment while a second mold compartment is closed off with a slide gate; moving the slide gate that closes off the second mold compartment from the first mold compartment out of the mold space; and injecting a second plastic material into the second mold compartment.
In a further aspect of the present invention, the injecting steps comprise the first plastic material and the second plastic material being injected at right angles towards each other into the corresponding first mold compartment and the second mold compartment, respectively.
In a yet further aspect of the present invention, the second plastic material injecting step comprises injecting the second plastic material into the second mold compartment after the first plastic material injected into the first mold compartment has shrunk.
In a further aspect of the present invention, the second plastic material is shrunk after injection, with its border surfaces contacting a first body formed by the first plastic material in such a manner, that the first body is held positively interlocked by the second plastic material forming a second body.
In a yet further aspect of the present invention, the moving step comprises simultaneously with an outward movement of the slide gate, moving at least one additional tool part towards the mold space.
In a further aspect of the present invention, the second plastic material injecting step comprises the step of injecting the second plastic material in correspondence with the direction of movement of the slide gate relative to the second mold compartment.
In yet a further aspect of the present invention, the slide gate moving step comprises bringing the slide gate into a first position, in which it closes the first mold compartment off against the second mold compartment completely, and is then moved into a second position, in which the slide gate which further comprises a cavity shaper creates a recess in a mini chip carrier to be formed in said second mold compartment during the second plastic material injection step.
In a further embodiment of the present invention, a device is provided to implement a process for manufacturing a chip card by injecting a molten plastic material into a mold and subsequently cooling down the plastic material, with the mold including at least one mold space and including form parts, which are movable in relation to each other and which comprise: a first injection nozzle for injecting the first plastic material into a first mold compartment in the mold space while a second mold compartment in the mold space is closed off with a slide gate; and a second injection nozzle for injecting a second plastic material into the second mold compartment after moving the slide gate out of the mold space wherein the first injection nozzle is positioned at a right angle relative to the second injection nozzle.
In yet a further implementation of the invention, a chip card is provided comprising: a mini chip card; and a surrounding card body, wherein the mini chip card is produced from a first plastic material and the card body is produced from a second different plastic material.
In a further aspect of the present invention, the plastic materials have such chemical characteristics, that the first and the second plastic materials are not combinable with each other within a temperature range including the operating temperature of the injection process to form a non-adhesive plastic-plastic-combination.
In a further aspect of the present invention, the first plastic material comprise one from the group of Polyamide (PA) and Polyacetal (POM), and the second plastic material comprises the other from the group of PA and POM.
In a yet further aspect of the present invention, the first plastic material comprises one from the group of Polyamide (PA) and Polyacetal (POM), and the second plastic material comprises the other from the group of PA and POM.
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Collins Deven M.
Foley & Lardner
Orga Kartensysteme GmbH
Picardat Kevin M.
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