Process for manufacturing base material for printed circuits

Details Process for manufacturing base material for printed circuits Process for manufacturing base material for printed circuits

1974-10-02

1976-04-06

Ansher, Harold

Adhesive bonding and miscellaneous chemical manufacture

Methods

156155, 156230, 156253, 428460, 428463, 428901, C23F 100, H05K 100, B32B 3122

Patent

active

039487016

ABSTRACT:
In a process for making a printed circuit, a method of forming a base for the circuit, including coating a cover foil with a decomposable film, then bonding the film to a carrier, and then removing the cover foil from the film.
A protected base useful for making printed circuits, comprising a synthetic-resin-based carrier, a decomposable adhesive film bonded to the carrier, and a removable cover foil bonded to the film, the adhesive film containing catalyst effective for the electroless deposition of metal conductors.

REFERENCES:
patent: 2070596 (1937-02-01), Hansen
patent: 2318096 (1943-05-01), Quick
patent: 2692190 (1954-10-01), Pritikin
patent: 2990310 (1961-06-01), Chan
patent: 3171756 (1965-02-01), Marshall
patent: 3212913 (1965-10-01), Mackenzie
patent: 3625758 (1971-12-01), Stahl et al.
patent: 3689332 (1972-09-01), Dietrich et al.
patent: 3784440 (1974-01-01), Grunwald et al.

Affiliated with

Also associated with

Rating

Process for manufacturing base material for printed circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing base material for printed circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing base material for printed circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1574710