Process for manufacturing a solar cell from a reject semiconduct

Metal working – Method of mechanical manufacture – Assembling or joining

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29575, 29578, 136 89C, 204192C, 427 91, B01J 1700

Patent

active

040621022

ABSTRACT:
A process for manufacturing a solar cell from a reject semiconductor wafer comprising stripping all external layers from the wafer, etching the surfaces of the wafer so as to effectively remove all P/N junctions without pitting the wafer surface, introducing a layer of dopant to form a P/N junction in the front wafer surface, forming a first patterned conductive electrode over the dopant layer, and forming a second conductive electrode on the back surface of the wafer. In the preferred embodiment a sputtering operation is used to form the conductive electrodes.

REFERENCES:
patent: 3151004 (1964-09-01), Glicksman
patent: 3533850 (1970-10-01), Tarneja
patent: 3600797 (1971-08-01), Bower
patent: 3617373 (1971-11-01), Mott
patent: 3772768 (1973-11-01), Fischer
patent: 3783050 (1974-01-01), Nanba
patent: 3923567 (1975-12-01), Lawrence
patent: 3985597 (1976-10-01), Zielinski

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