Process for manufacturing a single in-line package for surface m

Details Process for manufacturing a single in-line package for surface m Process for manufacturing a single in-line package for surface m

1995-05-15

1998-03-17

Graybill, David

Fishing, trapping, and vermin destroying

437211, 437217, H01L 2156, H01L 2158, H01L 2160

Patent

active

057286019

ABSTRACT:
A process for manufacturing semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by the package body to extend substantially perpendicularly to a bottom edge surface of the package body. The package body carries a cutout part at a predetermined position of a side edge that surrounds the package body such that the cutout part is adapted for engagement with a support leg for supporting the package body substantially upright on a substrate.

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patent: 5413970 (1995-05-01), Russell
patent: 5451815 (1995-09-01), Taniguchi et al.

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