Process for manufacturing a semiconductor device having a stiffe

Details Process for manufacturing a semiconductor device having a stiffe Process for manufacturing a semiconductor device having a stiffe

1996-12-12

2000-02-01

Graybill, David E.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

H01L 2152, H01L 2158, H01L 2160

Patent

active

060202211

ABSTRACT:
The subject method comprises providing a semiconductor package and a semiconductor package substrate having respective first and second major sides. A stiffener member, which is attachable to the semiconductor package substrate, is employed for purposes of minimizing package warpage. The stiffener member is attached to the semiconductor package substrate to provide the requisite support for the semiconductor package substrate during the assembly process and thereby counteract the sources of the package warpage problem. A protective outer layer can be optionally added to the subject system.

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