Process for manufacturing a semiconductor device affixed to an u

Details Process for manufacturing a semiconductor device affixed to an u Process for manufacturing a semiconductor device affixed to an u

1992-12-24

1995-04-25

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437217, 437220, 257672, 26427217, H01L 2156, H01L 2158, H01L 21603

Patent

active

054098661

ABSTRACT:
A process for manufacturing semiconductor device including a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

REFERENCES:
patent: 3778887 (1973-12-01), Suzuki et al.
patent: 4234666 (1980-11-01), Gursky
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5172214 (1992-12-01), Casto

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