Process for manufacturing a semiconductor arrangement

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156646, 156653, 156643, B44C 122, C03C 1500

Patent

active

047102640

ABSTRACT:
In a process for manufacturing a semiconductor arrangement, wherein an uneven surface of the semiconductor arrangement is smoothened, there is produced on the uneven surface an insulating layer of such thickness that the insulating layer produced on the surface exhibits an even surface. The insulating layer is then partially removed again.

REFERENCES:
patent: 4377438 (1983-03-01), Moriya et al.
patent: 4566940 (1986-01-01), Itsumi et al.
patent: 4568632 (1986-02-01), Blum et al.
patent: 4601781 (1986-07-01), Mercier et al.
Solid State Photo Resist Technology/Jun. 71, K. R. Dunham, pp. 41-46, "Solid State Technology."
Multilayer Resist Processes & Alternatives, Semiconductor International, Mar. 84, pp. 83-88, D. W. Johnson.
"Layer Resist Systems for Lithography," Solid State Technology/Aug. 81, pp. 74-80, Hatzakis.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for manufacturing a semiconductor arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing a semiconductor arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing a semiconductor arrangement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1929695

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.