Process for manufacturing a resin molded image pick-up semicondu

Details Process for manufacturing a resin molded image pick-up semicondu Process for manufacturing a resin molded image pick-up semicondu

1995-01-23

1997-04-22

Niebling, John

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

26427217, 438116, H01L 2156, H01L 2158, H01L 2160

Patent

active

056228732

ABSTRACT:
A process for packaging a solid type image pick-up device and a device produced by the packaging process. The process includes the steps of: forming a protecting layer on a light receiving region of an image pick-up chip formed on a semiconductor wafer; separating the image pick-up chip after forming the protecting layer; attaching the image pick-up chip on a lead frame and connecting leads of the lead frame to a pad of the separated image pick-up chip; sealing the chip within a chip-receiving body by molding with a resin and by using a mold having a projection, the projection extending to the protecting layer; and removing the protecting layer, and sealing a transparent plate on a cavity formed by the projection.

REFERENCES:
patent: 4707725 (1987-11-01), Ito
patent: 4894707 (1990-01-01), Yamawaki et al.
patent: 5026667 (1991-06-01), Roberts, Jr.
patent: 5424249 (1995-06-01), Ishibashi
patent: 5438216 (1995-08-01), Juskey et al.

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