Process for manufacturing a printed circuit board by coating a p

Details Process for manufacturing a printed circuit board by coating a p Process for manufacturing a printed circuit board by coating a p

1990-11-20

1992-10-06

Lusignan, Michael

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427305, 427306, 4274431, 427316, 427322, 427384, B05D 512

Patent

active

051530244

ABSTRACT:
A process for the manufacture of a multilayer printed circuit board including the step of depositing a noble metal onto an electrically non-conducting substrate. The substrate is first coated with a layer of polyamine polymer modified by being contacted with a compound containing at least two functional groups reactive to amino groups. The coated substrate is then contacted with noble metal ions.

REFERENCES:
patent: 3677921 (1972-07-01), Stivers
patent: 3766299 (1973-10-01), Dornte
patent: 4335164 (1982-07-01), Dillard et al.
patent: 4701351 (1987-10-01), Jackson
patent: 4734299 (1988-03-01), Motuzaki et al.
patent: 4775449 (1988-10-01), Dumas et al.
patent: 4873136 (1989-10-01), Foust et al.
patent: 4910045 (1990-03-01), Giesecke et al.
patent: 5084299 (1992-02-01), Hirsch et al.

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