Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-08-02
1996-10-01
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156223, 156252, 156293, 156298, 156300, 29846, 29853, B32B 3118, B32B 3120
Patent
active
055607950
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The invention relates to a method for producing a printed circuit board (PCB) with at least two layers in accordance with the description herein. In addition, the subject-matter of the present invention is a printed circuit board having at least two layers, in accordance with the description herein.
Multilayer printed circuit boards having two or more conductor layers which are interconnected by means of through-hole connections, are used on a large scale in the electronics industry. Printed circuit boards having at least three layers are designated multilayer printed circuit boards or multilayers.
BACKGROUND ART
In order to produce electrically conductive connections between the individual conductor planes of multilayer printed circuit boards, methods are known for the electro-chemical metallization (through-plating) of previously drilled or punched holes. This type of through hole plating is normally used only in the case of epoxy resin glass laminates and is technically very complex, and hence expensive.
In the case of two-layer printed circuit boards consisting of base materials which are copper-laminated on both sides, it is known for the electrically conductive connection of conductor tracks on both sides to be produced by pressing an electrically conductive paste into previously drilled holes. The conductive paste is subsequently cured under the influence of relatively high temperatures. This method suffers from insufficient reliability of the through hole connecting.
DE-A-1,540,249, EP-A2-0,137,279, and FR-A-1,464,288 each disclose methods in which a further, relatively thin printed circuit board layer consisting of a carrier material layer with a ready-etched conductor pattern is applied onto a carrier board. The electrically conductive connection of the contact areas or connecting areas of the individual planes (layers) takes place by soldering, through hole connecting taking place only in the region of the leads of component parts. In consequence, the practical usefulness of the method is limited.
A similar method is disclosed in U.S. Pat. No. 3,052,823, the laminated-on second or further printed circuit layer having openings in order to obtain access to the contact areas of the conductor layer located underneath in each case. The through-connecting takes place by means of soldering in the edge regions of these openings, it being possible to connect contact points or connecting points which lie side-by-side directly, that is to say without the aid of connecting wires. This method provides sufficient reliability only in the case of hand soldering, so that large-scale industrial use could not be implemented.
DE-B1-1,923,199 discloses a method for producing a circuit board having at least two conductor layers which are separated from one another by insulating layers, in the case of which method the conductor layers are connected at points by means of contact spots, which are coated for example with solder, through openings in the insulating layers. The through-connecting takes place by pressing on the contact areas, using selective pressure, the outer layer being pressed onto the inner layer and being connected thereto. U.S. Pat. No. 4,319,708 also discloses a similar method. These methods are extremely complex and do not permit the production of high density multilayer circuit boards.
A multilayer is described in EP-A 0 146 241. Conductor layers consisting of a conductive resinous composition are produced on the opposite surfaces of at least two carrier materials and an interposed carrier material, . At determined points the carrier material is punched and all carrier materials subsequently are thermolaminated. By this a multilayered circuit board is produced without pads and external carrier material on both sides. The technique described in the aforementioned document, however, cannot be applied for metallic printed circuit.
Finally, DE-A1-3,152,603 (=EP-A1-0,067,231) discloses a method of the generic type in which an insulation coating which leaves the contact areas free is
REFERENCES:
patent: 3388457 (1968-07-01), Totta
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4751126 (1988-06-01), Oodaira et al.
patent: 4894317 (1990-01-01), Maruyama et al.
Bruckner Helmut
Kopnick Siegfried
Uggowitzer Werner
Ball Michael W.
Philips Electronics N.V.
Yad Sam Chuan
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