Metal working – Method of mechanical manufacture – Electrical device making
Patent
1981-10-19
1984-02-07
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
148 25, 427 96, H05K 334
Patent
active
044294573
ABSTRACT:
The printed circuit board for mounting electronic parts thereon is obtained by transferring flux from a supporting film to the surface of a printed circuit board, and soldering the electronic parts thereto after the supporting film is removed. The supporting film is first coated with the flux, and the flux is transferred to the printed circuit board through the application of heat and pressure. Hot air can be blown from an oblique direction on the flux-coated surface of the printed circuit board after the flux is transferred thereto and before the electronic parts are soldered thereto.
This method can provide a uniform flux coat on the printed circuit board and can eliminate various drawbacks which are encountered in conventional approaches in which the surface of the printed circuit board is coated directly with flux in liquid form.
REFERENCES:
patent: 3730782 (1973-05-01), Poliak et al.
patent: 4127436 (1978-11-01), Friel
patent: 4194931 (1980-03-01), Zado
Hasegawa Kiketsu
Noguchi Yoshiyasu
Saito Shozo
Yokokoji Shoji
Arbes Carl J.
Goldberg Howard N.
Toppan Printing Co. Ltd.
LandOfFree
Process for manufacturing a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for manufacturing a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing a printed circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2155574