Process for manufacturing a package for mating with a bare semic

Details Process for manufacturing a package for mating with a bare semic Process for manufacturing a package for mating with a bare semic

1995-10-30

1996-12-31

Niebling, John

Fishing, trapping, and vermin destroying

437 3, 437207, 437208, 437217, H01L 2156, H01L 2160, H01L 2170

Patent

active

055894020

ABSTRACT:
A method for interconnecting electrical system components. A leadframe (10) having leads (11) is encapsulated within a molding compound to form a first section (36) of the interconnect package (35). The first section (36) optionally includes channels (54). A leadframe (20) having leads (22, 23) is encapsulated within a molding compound to form a second section (37) of the interconnect package (35). The first and second sections (36 and 37, respectively) are coupled together with an adhesive material (43). An end (44) is removed from the interconnect package (35) forming an edge (50). A bare semiconductor chip (51) is coupled to the edge (50).

REFERENCES:
patent: 3982123 (1976-09-01), Goell et al.
patent: 4136357 (1979-01-01), Frederiksen
patent: 4188708 (1980-02-01), Frederiksen
patent: 4398235 (1983-08-01), Lutz et al.
patent: 4433898 (1984-02-01), Nasiri
patent: 4598307 (1986-07-01), Wakabayashi
patent: 4686323 (1987-08-01), Bitir et al.
patent: 4732446 (1988-03-01), Gipson et al.
patent: 4857746 (1989-08-01), Kuhlmann et al.
patent: 4900118 (1990-02-01), Yanagawa et al.
patent: 4904036 (1990-02-01), Blonder
patent: 5101465 (1992-03-01), Murphy
patent: 5123066 (1992-06-01), Acarlar
patent: 5181216 (1993-01-01), Ackerman et al.
patent: 5249245 (1993-09-01), Lebby et al.
patent: 5311604 (1994-05-01), Rogner et al.
patent: 5318926 (1994-06-01), Dlugokecki
patent: 5343544 (1994-08-01), Boyd et al.
patent: 5353364 (1994-10-01), Kurashima
patent: 5357103 (1994-10-01), Sasaki
patent: 5359224 (1994-10-01), Heinen et al.
patent: 5387814 (1995-02-01), Baudouin et al.
patent: 5394008 (1995-02-01), Ito et al.

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