Process for manufacturing a multilayer integrated circuit interc

Details Process for manufacturing a multilayer integrated circuit interc Process for manufacturing a multilayer integrated circuit interc

1991-07-23

1993-11-16

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437208, 437215, 437915, H01L 2128, H01L 2156, H01L 2158, H01L 2160

Patent

active

052623513

ABSTRACT:
The invention is a method of producing a multilayer polymer-metal system to interconnect integrated circuits which allows two-dimensional electrical and/or optical connections between components, in which a first layer of polymer is deposited on a rigid substrate such that the layer can be separated from the substrate, in which a multilayer interconnection system is then produced on this first layer using industrial methods and in which the rigid substrate is removed after installation and connection of the integrated circuit.

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B. T. Clark, et al. "Integrated Stacking Spacer for Metallized Ceramic Modules".
IBM Technical Disclosure Bulletin, vol. 8, No. 10, Mar. 1966, pp. 1325-1326, New York, U.S.
N. E. Beverly, et al. "Multilayer Electronic Package" Optics Communications, vol. 73, No. 1, Sep. 1, 1989 pp. 23-31 Amsterdam, NL.
J. J. Cousty, et al. "Study of Grooves in Silicon Chip as Means of Optical Interconnections in VLSI Circuits".

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