Process for manufacturing a multilayer circuit board

Details Process for manufacturing a multilayer circuit board Process for manufacturing a multilayer circuit board

1982-07-16

1984-12-25

Bell, James J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

174 685, 427 96, 427 97, 428204, 428210, 428131, 428901, B32B 300

Patent

active

044904290

ABSTRACT:
The multilayer circuit board is constituted of an inorganic insulating material such as a crystallizable glass, crystalline oxide or noncrystallized glass; a conductive material such as a metal or a mixture of a metal with noncrystallized glass; a resistor material consisting of a mixture of a conductive material with the crystallizable glass or noncrystallized glass; and a dielectric material consisting of a mixture of a barium titanate-other oxide mixture with the noncrystallized glass or crystallizable glass, of a lead-containing perovskite type oxide or of a lead-containing laminar bismuth oxide, said board has a multilayer structure wherein a first insulating layer; a first resistor circuit or alternatively first capacitor circuit or alternatively first resistor-capacitor circuit; a second insulating layer; a second resistor circuit or alternatively second capacitor circuit or alternatively second resistor-capacitor circuit are superposed in this order, provided that the second insulating layer has a through-hole(s) filled with the conductive material, and a process for producing the same.

REFERENCES:
patent: 4301324 (1981-11-01), Kuman et al.

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