Process for manufacturing a multi-layer lead frame

Details Process for manufacturing a multi-layer lead frame Process for manufacturing a multi-layer lead frame

1994-09-28

1996-10-22

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29 2501, 29429, 156261, B32B 3118, H05K 336

Patent

active

RE0353531

ABSTRACT:
A process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a metal strip. The metal strip is then punched to cut and remove the metal plane, which is then laminated and heat-pressed to another metal strip. After completely adhered, the other metal strip is punched to remove a multi-layer lead frame.

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patent: 4683023 (1987-07-01), Sokolovsky
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4985105 (1991-01-01), Masuda
patent: 5023751 (1991-06-01), Stampfli
Patent Abstracts of Japan, vol. 010, No. 347, (E-457), Nov. 21, 1986 and JP-A-61,150,253 (Furukawa Electric Co., Ltd.), Jul. 8, 1986.
Proceedings of the 1989 Japan International Electronics Symposium, Apr. 26, 1989, NARA, Japan, pp. 221-229, D. Mallik et al., "Multi-Layer Molded Plastic Package".

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