Process for manufacturing a multi-chip module

Details Process for manufacturing a multi-chip module Process for manufacturing a multi-chip module

1991-11-07

1995-02-07

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29593, 29413, 29846, 361795, B23P 1700, H05K 330, H05K 302

Patent

active

053866231

ABSTRACT:
A multi-chip module and a process for manufacturing the same comprises at least first and second semiconductor chips each formed with a plurality of semiconductor elements on their circuit forming surfaces and having different functions, mounted on a substrate. An insulating film is formed over the circuit forming surfaces of the first and second semiconductor chips. First and second connecting holes are formed in the insulating film over the circuit forming surfaces of the first and second semiconductor chips, respectively. A wiring layer is formed across the first and second connection holes so as to connect the first and second semiconductor chips electrically.

REFERENCES:
patent: 3757175 (1973-09-01), Kim et al.
patent: 4317274 (1982-03-01), Yasunari
patent: 4423547 (1984-01-01), Farrar et al.
patent: 4628590 (1986-12-01), Udo et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 5100812 (1992-03-01), Yamada et al.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, No. 2, Jun. 1989; pp. 185-194.

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