Process for manufacturing a microfluidic device with buried...

Chemistry: molecular biology and microbiology – Apparatus – Including measuring or testing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C435S006120, C435S091200, C435S287200, C435S303100

Reexamination Certificate

active

07452713

ABSTRACT:
A process for manufacturing a microfluidic device, including the steps of: forming at least one channel in a semiconductor material body; forming a dielectric diaphragm above the channel, for closing the channel; and forming heating elements for providing thermal energy inside the channel. The heating elements are formed directly on said dielectric diaphragm.

REFERENCES:
patent: 5429734 (1995-07-01), Gajar et al.
patent: 5637469 (1997-06-01), Wilding et al.
patent: 5639423 (1997-06-01), Northrup et al.
patent: 5856174 (1999-01-01), Lipshutz et al.
patent: 5922591 (1999-07-01), Anderson et al.
patent: 5939312 (1999-08-01), Baier et al.
patent: 5942443 (1999-08-01), Parce et al.
patent: 6046056 (2000-04-01), Parce et al.
patent: 6168948 (2001-01-01), Anderson et al.
patent: 6174675 (2001-01-01), Chow et al.
patent: 6261431 (2001-07-01), Mathies et al.
patent: 6267858 (2001-07-01), Parce et al.
patent: 6326083 (2001-12-01), Yang et al.
patent: 2001/0036672 (2001-11-01), Anderson et al.
patent: 2002/0022261 (2002-02-01), Anderson et al.
patent: 2002/0045244 (2002-04-01), Barlocchi et al.
patent: 2002/0055167 (2002-05-01), Pourahmadi et al.
patent: 2002/0060156 (2002-05-01), Mathies et al.
patent: 2002/0068334 (2002-06-01), Carrino et al.
patent: 2002/0068357 (2002-06-01), Mathies et al.
patent: 2003/0057199 (2003-03-01), Villa et al.
patent: 1043770 (2000-10-01), None
patent: 1049157 (2000-11-01), None
patent: 1130631 (2001-05-01), None
patent: 1123739 (2001-08-01), None
Esashi et al. Vacuum-Sealed Silicon Micromachined Pressure Sensors. 1998. Proceedings of the IEEE, vol. 86, No. 8, p. 1627-1639.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for manufacturing a microfluidic device with buried... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing a microfluidic device with buried..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing a microfluidic device with buried... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4038335

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.