Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1999-04-05
1999-11-16
Graybill, David E.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
438 29, 438115, 438122, 438118, H01L 2152, H01L 2158
Patent
active
059856840
ABSTRACT:
A process for manufacturing a laser diode package including a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and first and second surfaces between the emitting surface and the reflective surface. The laser diode has a diode height defined between the emitting surface and the reflective surface. The heat sink has an interior surface, an exterior surface opposing the interior surface, a top surface and a base surface. The height of the heat sink is defined between the top surface and the base surface and is approximately less than four times the laser diode height. The first surface of the diode is attached to the interior surface of the heat sink with a first solder. The base surface of the heat sink is coupled to a thermal reservoir. The lid is attached to the second surface of the laser diode via a second solder. An upper end of the lid is near the emitting surface of the laser diode. A lower end of the lid is typically slightly below the reflecting surface of the laser diode. The heat sink of the laser diode packages is attached to a backplane which is then connected to a thermal reservoir.
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Koenig Herbert G.
Marshall Dana A.
Cutting Edge Optronics, Inc.
Graybill David E.
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