Metal deforming – With 'coating' of work – Metal coating
Reexamination Certificate
2001-12-17
2004-03-30
Zimmerman, John J. (Department: 1775)
Metal deforming
With 'coating' of work
Metal coating
C428S607000, C428S672000, C427S117000, C427S125000, C427S357000
Reexamination Certificate
active
06711925
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, more particularly to a process for manufacturing a conductive wire having the effects of reduced cost and good signal transmission. The invention also relates to a conductive wire manufactured by the process.
2. Description of the Related Art
Conventional conductive wires used in semiconductor packages are made of pure gold to achieve high quality signal transmission. However, since pure gold is expensive, it is difficult to reduce the cost for manufacturing the conventional conductive wire.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide a process for manufacturing a conductive wire that is suitable for use in semiconductor packages and that has the effects of reduced cost and good signal transmission.
Accordingly, the process for manufacturing a conductive wire of the present invention comprises the steps of: preparing a core wire of an extensible metal other than gold, the core wire having a diameter ranging from 300 &mgr;m to 500 &mgr;m and an outer surface; plating a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m onto the outer surface of the core wire so as to form a gold-plated core wire; and drawing the gold-plated core wire into the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.
REFERENCES:
patent: 6092358 (2000-07-01), Grosz
patent: 6261436 (2001-07-01), Chang
patent: 4125980 (1993-02-01), None
patent: 51-085669 (1979-08-01), None
patent: 56-021354 (1981-02-01), None
patent: 64-017436 (1989-01-01), None
patent: 01-259541 (1989-10-01), None
patent: 04-206646 (1992-07-01), None
patent: 11-243111 (1999-09-01), None
patent: 2001-196441 (2001-07-01), None
Asep Tec Co., Ltd.
Zimmerman John J.
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