Process for manufacturing a bottom spin valve structure

Details Process for manufacturing a bottom spin valve structure Process for manufacturing a bottom spin valve structure

2006-07-11

2006-07-11

Talbot, Brian K. (Department: 1762)

Coating processes

Magnetic base or coating

Magnetic coating

C427S131000, C029S603130, C029S603140

Reexamination Certificate

active

07074456

ABSTRACT:
Currently, the shield-to-shield separation of a spin valve head cannot be below about 800 Å, mainly due to sensor-to-lead shorting problems. This problem has now been overcome by inserting a high permeability, high resistivity, thin film shield on the top or bottom (or both) sides of the spin valve sensor. A permeability greater than about 500 is required together with a resistivity about 5 times greater than that of the free layer and an MrT value for the thin film shield that is 4 times greater than that of the free layer. Five embodiments of the invention are described.

REFERENCES:
patent: 5301079 (1994-04-01), Cain et al.
patent: 5422571 (1995-06-01), Gurney et al.
patent: 5452163 (1995-09-01), Coffey et al.
patent: 5574605 (1996-11-01), Baumgart et al.
patent: 5608593 (1997-03-01), Kim et al.
patent: 5668688 (1997-09-01), Dykes et al.
patent: 5777542 (1998-07-01), Ohsawa et al.
patent: 5828527 (1998-10-01), Takada et al.
patent: 5978182 (1999-11-01), Kanai et al.
patent: 5999379 (1999-12-01), Hsiao et al.
patent: 6175476 (2001-01-01), Huai et al.
patent: 6228276 (2001-05-01), Ju et al.
patent: 6385017 (2002-05-01), Min et al.
patent: 6721143 (2004-04-01), Zheng et al.
patent: 6816346 (2004-11-01), Zheng et al.
U.S. Patent Appl. HT-98-024/025 filed Sep. 30, 1999, U.S. Appl. No. 09/408,492 now issued as U.S. Patent.
“Greater Than 14 Gb/in2Spin Valve Heads”, H.C. Tang et al., IEEE Trans. on Magnetics, vol. 35, No. 5, Sep. 1999, pp. 2574-2579.
“Readback Signal Comparison Between DSMR&SAL/MR Heads”, Yimin Guo et al., IEEE Trans. on Magnetics, vol. 32, No. 5, Sep. 1996, pp. 3437-3439.

Affiliated with

Also associated with

Rating

Process for manufacturing a bottom spin valve structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing a bottom spin valve structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing a bottom spin valve structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3546247