Process for manufacture of spring contact elements and assembly

Details Process for manufacture of spring contact elements and assembly Process for manufacture of spring contact elements and assembly

1994-12-14

1997-03-11

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29882, 439 66, H01R 4300

Patent

active

056089660

ABSTRACT:
A method of manufacturing thousands of contacts between electronic packages and their next package level by use of small wires retained within a interposer structure or soldered directly into a printed circuit board or onto the module. Each wire can be either a signal or power connection. The wires may have multiple cross-sectional shapes compared to one another and are preformed before assemble into an array retainer. The retainers contain the multiplicity of wires and are used for additional process steps and as the final housing of the connector assembly.

REFERENCES:
patent: 3766646 (1973-10-01), Froebe et al.
patent: 3921285 (1975-11-01), Krall
patent: 4190951 (1980-03-01), Armstrong
patent: 4706382 (1987-11-01), Suppinger et al.
patent: 4764848 (1988-08-01), Simpson
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5248262 (1993-09-01), Busacco et al.
IBM Technical Disclosure Bulletin, vol. 28, No. 3, Aug. 1985, entitled "High Density Pinless Module Array Connector" by R. Darrow et al, pp. 1079-1081.

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