Process for manufacture of printed circuit boards

Details Process for manufacture of printed circuit boards Process for manufacture of printed circuit boards

1994-06-15

1996-03-12

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

216 35, 216 67, 216 48, 216 78, B44C 122, C23F 100, B29C 3700

Patent

active

054983118

ABSTRACT:
A method for manufacture of printed circuit boards uses plasma etch back/desmear, carbon deposits on board surfaces to be plated and panel plating. The plated board is abrasively pre-treated, imaged, developed, etched, and stripped for final preparation before drilling. The pre-treating, imaging, developing, etch back and stripping used for inner panel boards is the same as the process steps and equipment used for the final process of the panel plated boards. The process is environmentally conscious in that it produces waste products which contain only one metal in solutions easily treated by conventional and non-conventional waste treatment technologies and eliminates or reuses by-products produced by other printed circuit board and produces waste products which contain only one metal.

REFERENCES:
patent: 4705592 (1987-11-01), Bahrle et al.
patent: 4853081 (1989-08-01), Mlynko
patent: 5284548 (1994-02-01), Carey et al.
patent: 5376232 (1994-12-01), McKenney

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