Process for manufacting a piezoelectric device

Details Process for manufacting a piezoelectric device Process for manufacting a piezoelectric device

2011-06-14

2011-06-14

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029SDIG016, C029S847000, C438S706000, C438S745000, C310S324000, C310S364000

Reexamination Certificate

active

07958608

ABSTRACT:
The piezoelectric device includes a substrate, a first electrode formed on the substrate, a piezoelectric film formed on the first electrode and a second electrode formed on a second side of the piezoelectric film which is away from a first side where the first electrode is formed. The first electrode is composed of a first layer in contact with the substrate and a second layer in contact with the piezoelectric film. The first layer is formed of a material that is wet etched at a different rate than the substrate. The ink-jet head includes the piezoelectric device, a liquid droplet storing/ejecting member for ejecting ink droplets through a ink spout and provided on the piezoelectric device and a diaphragm for vibrating in response to expansion or contraction of the piezoelectric device and provided between the piezoelectric device and the liquid droplet storing/ejecting member.

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Chen Chao et al., “Measurement of Longitudinal Piezoelectric Coefficient of Lead Zirconate Titanate Thin/Thick Films Using a Novel Scanning Mach-Zehnder Interferometer”, Thin Solid Films, vol. 493, Dec. 31, 2005, pp. 313-316.
Chinese Office Action issued Sep. 4, 2009, in corresponding Chinese Application No. 200810213853.8.

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