Process for making wire

Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29 178, 29 172, 29413, 29412, C25D 104

Patent

active

056792328

ABSTRACT:
This invention relates to a process for making metal wire, comprising: (A) forming metal foil; (B) cutting said foil to form at least one strand of metal wire; and (C) shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This process is particularly suitable for making copper wire, especially copper wire having a very thin diameter (e.g., about 0.0002 to about 0.02 inch).

REFERENCES:
patent: 440548 (1890-11-01), Elmore
patent: 1058048 (1913-04-01), Gibbs
patent: 2074713 (1937-10-01), Tross
patent: 3556957 (1971-01-01), Toledo et al.
patent: 3683662 (1972-08-01), Dechene et al.
patent: 3799859 (1974-03-01), Wallin
patent: 3811309 (1974-05-01), Nordstrom
patent: 3929610 (1975-12-01), Wang
patent: 3939745 (1976-02-01), Weeks et al.
patent: 4018073 (1977-04-01), Bartram et al.
patent: 4037445 (1977-07-01), Winter et al.
patent: 4083758 (1978-04-01), Hamby et al.
patent: 4193846 (1980-03-01), Barrett
patent: 4891105 (1990-01-01), Sein
patent: 4956053 (1990-09-01), Polan
patent: 5031432 (1991-07-01), Loesch et al.
patent: 5060499 (1991-10-01), Poloni
patent: 5066366 (1991-11-01), Lin
patent: 5086634 (1992-02-01), Richards
patent: 5215645 (1993-06-01), DiFranco et al.
patent: 5238048 (1993-08-01), Hackman
patent: 5366612 (1994-11-01), Clouser et al.
patent: 5421985 (1995-06-01), Clouser
patent: 5454926 (1995-10-01), Clouser
patent: 5516408 (1996-05-01), Peckham
PCT/US96/18040, PCT International Search Report mailed Apr. 28, 1997.
G.D. Bucci et al, Copper Foil Technology, "After The Base Foil Production, The Base Material Is Subjected To A Variety Of Treatment Processes", PC FAB, Jul., 1986, pp. 22, 27-30, 33.
W.H. Safranek et al, "Fast Rate Electrodeposition", Transactions of the Insitute of Metal Finishing , 1975, vol. 53.
D.J. Arrowsmith, "Adhesion of Electroformed Copper and Nickel to Plastic Laminates", Transactions of the Institute of Metal Finishing, 1970, vol. 48.
CS Analysis: Electrowon Cathode Quality, "Electrowon Cathode Takes Growing Share of Wiremill Market, CRO Copper Studies", vol. 18, No. 10, Apr. 1991.
17447, "High Speed Tinning-Line for Copper Wire", Tin and Its Uses, (59), 4-6 (1963).
17448, Makowski et al, "Properties of Electrodeposited Foils for Use in Printed Circuits" Paper from Symposium on Electrodeposited Metals as Materials for Selected Applications. Jan. 1972, pp. 14-31.
24051, Coppertron, "An Installation For And Method Of Electrolytic Production Of Copper Foil", British Patent 1,588,681 (Apr. 29, 1981).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for making wire does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for making wire, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making wire will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1003886

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.