Process for making single-in-line integrated electronic componen

Details Process for making single-in-line integrated electronic componen Process for making single-in-line integrated electronic componen

1986-12-15

1987-12-08

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

437209, 437220, H01R 4300

Patent

active

047110236

ABSTRACT:
Method for making an insulating package premolded on a metallic frame with electrical contacts containing in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.

REFERENCES:
patent: 3581387 (1971-06-01), Buck et al.
patent: 4012765 (1977-03-01), Lehner et al.
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4637130 (1987-01-01), Fujii et al.
patent: 4649637 (1987-03-01), Hatakeyama

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