Process for making semiconductor electrode bumps by metal cluste

Details Process for making semiconductor electrode bumps by metal cluste Process for making semiconductor electrode bumps by metal cluste

1992-06-09

1994-03-01

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437196, 437930, H01L 21285

Patent

active

052907325

ABSTRACT:
Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, and multiple sources for depositing alloyed (tin-lead) bumps with constant composition.

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