Process for making preforms useful for encapsulating semiconduct

Details Process for making preforms useful for encapsulating semiconduct Process for making preforms useful for encapsulating semiconduct

1997-06-04

1998-09-08

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

26432816, 26432817, 26427211, B29C 3104, B29C 4502, B29C 4573

Patent

active

058041265

ABSTRACT:
Preform useful for encapsulating semiconductors and other electric or electronic devices are prepared by a process which comprises warming thermoset resin to form a melt, injecting it into a mold, and cooling to form a solidified molding, all without substantially curing the thermoset resin.

REFERENCES:
patent: 2272449 (1942-02-01), Wacker
patent: 2338607 (1944-08-01), Wacker
patent: 4468508 (1984-08-01), Ito et al.
patent: 4554126 (1985-11-01), Sera
patent: 4569814 (1986-02-01), Chong et al.
patent: 4645445 (1987-02-01), Takanashi
patent: 4714423 (1987-12-01), Hattori et al.
patent: 4740150 (1988-04-01), Sayer
patent: 4758398 (1988-07-01), Sparapany et al.
patent: 4793785 (1988-12-01), Osada
patent: 4931515 (1990-06-01), Takagishi et al.
patent: 5013228 (1991-05-01), Thornthwaite et al.
patent: 5043199 (1991-08-01), Kubota et al.
patent: 5098626 (1992-03-01), Pas
patent: 5110279 (1992-05-01), Amemiya et al.
patent: 5132069 (1992-07-01), Newton
patent: 5151276 (1992-09-01), Sato et al.
patent: 5198232 (1993-03-01), Thornthwaite et al.
patent: 5200125 (1993-04-01), Osada
patent: 5232654 (1993-08-01), Aida et al.
patent: 5266261 (1993-11-01), Suter
patent: 5431854 (1995-07-01), Pas
Pennwalt/Stokes Technical Bulletin #11, Factors Determining the Hardness of Tablets.
Stokes-Merrill, Inc. Laboratory Information Bulletin #14, Tablet Making.
Sumitomo Chemical Co., Ltd., Sumi-Epoxy ESB-400.
Sumitomo Chemical Co., Ltd., Sumi-Epoxy ESCN, Analysis of Molding Compound Produced by Japanese Manufacturers.

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