Process for making planar redistribution structure

Details Process for making planar redistribution structure Process for making planar redistribution structure

1998-04-20

1999-12-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29840, H01K 310

Patent

active

060001305

ABSTRACT:
A self-supporting redistribution structure for directly mounting a semi-conductor chip to a multilayer electronic substrate is separately fabricated and then laminated to the multilayer substrate. The redistribution structure comprises a dielectric layer having plated vias communicating between its two major surfaces, redistribution lines and input/output pads on its upper major surface and joining patterns on its lower margin surface for electrical connection with the multilayer substrate. The metal plating in the plated vias of the redistribution device connects respective input/output pads on the upper surface of the redistribution structures with the joining patterns on its lower major surface. Input/output pads define an even (planar) topography with the redistribution lines to facilitate flip chip joining.

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