Process for making non-uniform minority carrier lifetime...

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Bidirectional rectifier with control electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S131000, C257S611000, C257S612000, C257S913000, C257SE21388

Reexamination Certificate

active

10911965

ABSTRACT:
An electronic power device comprising a single crystal silicon segment being characterized in that the segment comprises a non-uniform distribution of minority carrier recombination centers, the minority carrier recombination centers comprising a substitutional metal, with the concentration of the centers in a bulk layer being greater than the concentration in a surface layer. The centers have a concentration profile in which the peak density of the centers is at or near the central plane with the concentration generally decreasing from the position of peak density in the direction of the front surface of the segment and generally decreasing from the position of peak density in the direction of the back surface of the segment.

REFERENCES:
patent: 3860947 (1975-01-01), Gamo et al.
patent: 3943549 (1976-03-01), Jaecklin et al.
patent: 4259683 (1981-03-01), Adler et al.
patent: 4314595 (1982-02-01), Yamamoto et al.
patent: 4376657 (1983-03-01), Nagasawa et al.
patent: 4437922 (1984-03-01), Bischoff et al.
patent: 4505759 (1985-03-01), O'Mara
patent: 4548654 (1985-10-01), Tobin
patent: 4851358 (1989-07-01), Huber
patent: 4868133 (1989-09-01), Huber
patent: 5075751 (1991-12-01), Tomii et al.
patent: 5327007 (1994-07-01), Imura et al.
patent: 5401669 (1995-03-01), Falster et al.
patent: 5403406 (1995-04-01), Falster et al.
patent: 5445975 (1995-08-01), Gardner et al.
patent: 5478408 (1995-12-01), Mitani et al.
patent: 5502010 (1996-03-01), Nadahara et al.
patent: 5502331 (1996-03-01), Inoue et al.
patent: 5528058 (1996-06-01), Pike, Jr. et al.
patent: 5534294 (1996-07-01), Kubota et al.
patent: 5539245 (1996-07-01), Imura et al.
patent: 5593494 (1997-01-01), Falster
patent: 5611855 (1997-03-01), Wijaranakula
patent: 5645736 (1997-07-01), Allman
patent: 5674756 (1997-10-01), Satoh et al.
patent: 5731626 (1998-03-01), Eaglesham et al.
patent: 5738942 (1998-04-01), Kubota et al.
patent: 5788763 (1998-08-01), Hayashi et al.
patent: 5939770 (1999-08-01), Kageyama
patent: 5944889 (1999-08-01), Park et al.
patent: 5994761 (1999-11-01), Falster et al.
patent: 6828690 (2004-12-01), Falster
patent: 43 23 964 (1994-01-01), None
patent: 0 327 316 (1989-08-01), None
patent: 0 536 958 (1993-04-01), None
patent: 0 694 960 (1996-01-01), None
patent: 0 716 168 (1996-06-01), None
patent: 0 503 816 (1996-09-01), None
patent: 54055371 (1979-05-01), None
patent: 1208830 (1989-08-01), None
patent: 3-9078 (1991-02-01), None
patent: 04125933 (1992-04-01), None
patent: 5155700 (1993-06-01), None
patent: 7201874 (1995-08-01), None
patent: 7321120 (1995-12-01), None
patent: 7335657 (1995-12-01), None
patent: 8045944 (1996-02-01), None
patent: 8045945 (1996-02-01), None
patent: 8045947 (1996-02-01), None
patent: 9199416 (1997-07-01), None
patent: 11067781 (1999-03-01), None
patent: 11150119 (1999-06-01), None
patent: WO 98/38675 (1998-09-01), None
patent: WO 98/45507 (1998-10-01), None
Deng, B. et al.—“Uniformalization of the Pt-induced-trap concentration profile in silicon by the two-step diffusion method”, Semicond. Sci Technol. 11 (1996) 535-537.
European Search Report for Application No. EP 04077447, dated Oct. 22, 2004, 4 pages.
Abe et al., “Innovated Silicon Crystal Growth andWafering Tecnologies”, Electrochem. Soc. Proc., vol. 97, No. 3 (1997) pp. 123-133.
Abe et al., “Defect-Free Surfaces of Bulk Wafers by Combination of RTA and Crystal Growth Conditions”, (publication information unknown).
European Examination Report for European Patent Application No. 99942012.8, dated Feb. 16, 2004, 4 pgs.
Falster et al., “The Engineering of Silicon Wafer Material Properties Through Vacancy Concentration Profile Control and the Achievement of Ideal Oxygen Precipitation Behavior”, Mat. Res. Soc. Symp. Proc., vol. 510, pp. 27-35, 1998.
Hara et al., “Enhancement of Oxygen Precipitation in Quenced Czochralski Silicon Crystals”, J. Appl. Phys., vol. 66, No. 8 (1989) pp. 3958-3960.
Hawkins et al., “Effect of Rapid Thermal Processing on Oxygen Precipitation in Silicon”, Mat. Res. Soc. Symp. Proc., vol. 104, pp. 197-2000, 1988.
Hawkins et al., “The Effect of Rapid Thermal Annealing on the Precipitation of Oxygen in Silicon”, J. Appl. Phys., vol. 65, No. 9, pp. 3644-3654, 1989.
Hemg-Der Chiou, “The Effects of Preheatings on Axial Oxygen Precipiation Uniformity in Czochralski Silicon Crystals”, J. Electrochem Soc., vol. 139, No. 6, Jun., 1992.
Jacob et al., “Determination of Vacancy Concentrations in the Bulk of Silicon Wafers by Platinum Diffusion Experiments”, J. Appl. Phys., vol. 82, No. 1 (1997) pp. 182-191.
Jacob et al., “Influence of RTP on Vacancy Concentrations”, Mat. Res. Soc. Symp Proc. vol. 490, pp. 129-134, 1998.
Nadahara et al., “Hydrogen Annealed Silicon Wafer”, Solid State Phenomena, vols. 57-58, pp. 19-26 (1997).
Pagani et al. “Spatial Variations in Oxygen Precipitation in Silicon after High Temperature Rapid Thermal Annealing”, Appl. Phys. Lett., vol. 79, No. 12, pp. 1572-1574, 1997.
Shimura, “Semiconductor Silicon Crystal Technology”, Academic Press, Inc., San Diego CA (1989) pp. 360-377.
Temple et al., “Optimizing Carrier Lifetime Profile for Improved Trade-off Between Turn-off Time and Forward Drop”, IEEE Transactions on Electron Devices, vol. ED-30, No. 7 (1983) pp. 782-790.
Winkler et al., “Improvement of the Gate Oxide Integrity by Modifying Crystal Pulling and Its Impact on Device Failures”, J. Electrochem. Soc., vol. 141, No. 5 (1994) pp. 1398-1401.
Zimmermann et al., “Gold and Platinum Diffusion: the Key to the Understanding of Intrinsic Point Defect Behavior in Silicon”, Applied Physics A Solids and Surfaces. vol. A55, No. 1 (1992) pp. 121-eoa.
Zimmermann et al., “Investigation of the Nucleation of Oxygen Precipitates in Czochralski Silicon at an Early Stage”, Appl. Phys. Lett., vol. 60, No. 26 (1992) pp. 3250-3253.
Zimmermann et al., “The Modeling of Platinum Diffusion in Silicon Under Non-equilibrium Conditions”, J. Electrochem. Soc., vol. 139, No. 1 (1992) pp. 253-262.
Zimmermann et al., “Vacancy Concentration Wafer Mapping in Silicon”, Journal of Crystal growth, vol. 129, Nos. 3/4 (1993) pp. 582-592.
Zimmermann, H.;Ryssel, H., “Observation of Inverse U-Shaped Profiles After Platinum Diffusion in Silicon,” Appl. Phys. Lett., 1991, pp. 1209-1211, vol. 59, No. 10.
Abe et al., “Defect-Free Surfaces of Bulk Wafers by Combination of RTA and Crystal Growth Conditions”, 31st Symposium on ULSI Ultra Clean Technology, Dec. 18-19, 1997, 11 pp., Tokyo Japan.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for making non-uniform minority carrier lifetime... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for making non-uniform minority carrier lifetime..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making non-uniform minority carrier lifetime... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3821637

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.