Process for making multi-layer cream-filled wafer blocks

Food or edible material: processes – compositions – and products – Assembling plural edible preforms having extraneous binder,... – Dough is preform

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Details

426274, 426 94, 426103, 994504, A21D 1300, A23G 300

Patent

active

043918328

ABSTRACT:
Cream-coated wafer sheets are conveyed by a feeder conveyor in a first plane to a stacking device. The coated wafers are raised in the stacking device into a second plane and by such a raising are attached to the lower sides of a wafer sheet already in the second plane to form a wafer block which is in a raised position with respect to the feeder conveyor. An uncoated covering wafer sheet is separately supplied to each wafer block such that the covering sheet is delivered directly into the second plane at the stacking point, and a coated sheet is attached to the lower side of this covering sheet by rising up into a position in which its cream coating contacts the lower side of the covering sheet. This separate, direct supply of the uncoated covering wafer sheet is effected by a covering sheet conveyor disposed above the feeder conveyor. The terminal end region of the covering sheet conveyor ends in the second plane at the upstream side of the stacking device.

REFERENCES:
patent: 4246290 (1981-01-01), Haas, Sr. et al.

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