Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1993-02-11
1994-07-12
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427123, 427250, 4272551, 156643, 156644, B05D 512
Patent
active
053287150
ABSTRACT:
A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.
REFERENCES:
patent: 4741928 (1988-05-01), Wilson et al.
patent: 5239746 (1993-08-01), Goldman
Eden, "Applicability of Diamond Substrates to Multi-Chip Modules", ISHM '91 Proceedings.
Das et al., "A Review of the Electrical Characteristics of Metal Contacts on Diamond", Thin Solid Films, 212, 19-24 (1992).
Roser et al., "High Temperature Reliability of Refractory Metal Ohmic Contacts to Diamond", J. Electrochem. Soc., 139 (1992).
Malshe et al., "Excimer Laser-Induced Etching of Non-Hydrogenated (a-C) and Hydrogenated (a-C:H) Diamond-Like Carbon Films: A Comparative Study", Materials Letters, 11, 175-179 (1991).
Hewett et al., "Issues in Diamond Device Fabrication", Diamond and Related Materials, 1, 688-691 (1992).
Wilson and Stoll, "Highly Selective, High Rate Tungsten Deposition Using `Hot Plate` Wafer Heating", Tungsten and Other Refractory Metals for VLSI III, V. A. Wells Ed, Materials Res. Soc. (1988).
Bogli et al., "Smoothening of Diamond Films With An ArF Laser", Diamond and Related Materials, 1, 782-788 (1992).
Iacovangelo Charles D.
Jerabek Elihu C.
Schaefer Peter C.
Wilson Ronald H.
Beck Shrive
General Electric Company
Maiorana David M.
Pittman William H.
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