Process for making hollow silicon bodies and bodies utilizing bo

Details Process for making hollow silicon bodies and bodies utilizing bo Process for making hollow silicon bodies and bodies utilizing bo

1976-07-13

1977-12-13

Rutledge, L. Dewayne

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

148174, 156613, 264 61, 264 81, 264104, 427 86, 427248R, H01L 2120, B29D 2300

Patent

active

040627144

ABSTRACT:
A process for making hollow silicon bodies by decomposition from a gaseous ompound containing silicon and depositing said silicon on heated carrier bodies, which comprises assembling in a decomposition device a number of board-shaped members of silicon to form a hollow carrier body, heating said body to the decomposition temperature of the gaseous compound, introducing the gas into the device whereby it is thermally decomposed, causing the silicon released thereby to become inseparately united with the hollow carrier body, the hollow silicon body so formed being immediately available for use in the semiconductor industries. The invention also comprises the silicon bodies so made.

REFERENCES:
patent: 2409958 (1946-10-01), Rogers et al.
patent: 3030189 (1962-04-01), Schweickert et al.
patent: 3222217 (1965-12-01), Grabmaier
patent: 3226254 (1965-12-01), Reuschel
patent: 3686378 (1972-08-01), Dietze
patent: 3751539 (1973-08-01), Reuschel et al.
patent: 3950479 (1976-04-01), Reuschel et al.
patent: 3966885 (1976-06-01), May

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