Process for making encapsulant for opto-electronic devices

Details Process for making encapsulant for opto-electronic devices Process for making encapsulant for opto-electronic devices

2007-12-04

2007-12-04

Feely, Michael J. (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C523S440000, C523S443000, C523S444000, C523S445000, C523S466000, C525S525000, C428S413000, C438S127000

Reexamination Certificate

active

11007766

ABSTRACT:
An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

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Machine translation of JP 06-065473, provided by the JPO website.
Machine translation of JP 2002-080698, provided by the JPO website.

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