Process for making electrical feedthroughs for ceramic circuit b

Details Process for making electrical feedthroughs for ceramic circuit b Process for making electrical feedthroughs for ceramic circuit b

1995-05-24

1997-08-05

Mayes, Melvin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156252, 29846, 205162, B32B 3126, B05D 512

Patent

active

056538340

ABSTRACT:
Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.

REFERENCES:
patent: 5073840 (1991-12-01), Coors
patent: 5216207 (1993-06-01), Prabhu et al.
patent: 5277724 (1994-01-01), Prabhu
patent: 5414224 (1995-05-01), Adasko et al.

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