Process for making electrical connections between two surfaces o

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

101170, 174 685, 118401, H01K 300

Patent

active

045397473

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

The invention is based on a process for making electrical connections between the two surfaces of a printed circuit board in accordance with the class of the main claim. Such a process is the subject matter of the associated main patent . . . (patent application No. P 31 45 584.0). The main patent relates to a process wherein the contacting of the printed circuit surfaces occurs through one or a plurality of bores, whereby a conductive paste is printed thereon by means of a deformable printing stamp. In such a process it is necessary to provide accurate bores in the printed circuit board which later are coated with conductive paste by means of the print stamp. The making of the bores in the printed circuit board requires additional operating expense, even then when the subsequent through contacting of the bores is carried out in a particulary simple and advantageous manner.
Known methods for electrical contacting of the two surfaces of printed circuit boards use either bores which are penetrated by an electrically conductive part or are provided with an electrically conductive metallization, or in a still more expensive operating process, whereby electrical connecting bridges are soldered onto the surfaces. These known processes require a considerable finishing technique expense and are therefore not cost effective.


SUMMARY OF THE INVENTION

The process in accordance with the invention with the characterizing features of the main claim permits in a particularly simple and effective manner to connect the two surfaces of a printed circuit board or concentrated area or individual conductive paths on the different surfaces of the printed circuit board without requiring expensive treatments of the printed circuit board. The process in accordance with the invention permits an exact positioning of the electrical connections with a minimum expense for material with respect to known processes, so that in addition to the finishing technique savings and improvement, advantages are obtained by lowering the expenses for the material.
Due to the stated measures in the subclaims, effective further developments and improvements of the process stated in the main claim are possible. In particular, the printing of a plurality of electrically conductive ribs permits a particularly economical connection of different areas or conductive paths on the opposite surfaces of the printed circuit board. In this manner a plurality of different connections can be made simultaneously in a particularly simple manner without the necessity of any previous operating step.


BRIEF DESCRIPTION OF THE DRAWINGS

The invention is schematically illustrated in the drawing and is explained in more detail in the following description.
FIG. 1 shows a view in direction of arrow I in FIG. 2.
FIG. 2 is a plan view of a printed circuit board and
FIG. 3 is a simplified illustration of the elastic deformable printing stamp.


DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 shows a schematic illustration, seen in direction of arrow I in FIG. 2. Therein reference numeral 10 designates a printed circuit board, its upper side has the reference numeral 11 and its lower side the reference numeral 12. Electrically conductive ribs 15 are provided on front faces 13 and 14 which connect the upper side 11 with the lower side 12. Conductive paths, areal electrically conductive layers or the like, which are not shown, may be disposed between the individual ribs 15. The reference numeral 16 designates a connecting part of a connecting element which engages on the front face of a printed circuit board 10 which is not occupied by the ribs 15.
The plan view shown in FIG. 2 of the printed circuit board 10 shows that the ribs 15 embrace the upper side 11 and also the lower side 12 of the printed circuit board, which cannot be seen in the drawing, so that the ribs can be easily contacted on the printed circuit board with conductive paths, not shown. The connecting elements 16 form a comb like connecting bar which engages on the front si

REFERENCES:
patent: 3324826 (1967-06-01), Oates
patent: 3589938 (1971-06-01), Blewett et al.
patent: 3701317 (1972-10-01), Miyamoto et al.
patent: 4289384 (1981-09-01), Samek
patent: 4485129 (1984-11-01), Grunwald et al.
IBM Tech. Discl. Bull., vol. 5, No. 11, Apr. 1963, p. 14, by K. J. Roche.
IBM Tech. Discl. Bull., vol. 14, No. 11, Apr. 1972, p. 3232, by L. F. Miller.

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