Process for making copper tungsten and copper molybdenum...

Details Process for making copper tungsten and copper molybdenum... Process for making copper tungsten and copper molybdenum...

2008-10-10

2011-11-01

Wyszomierski, George (Department: 1733)

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Post sintering operation

C419S039000

Reexamination Certificate

active

08048366

ABSTRACT:
From tungsten or molybdenum powders, a tungsten or molybdenum compact is pressurized and molded into the same dimensions as or slightly larger than the end product and sintered into tungsten or molybdenum skeleton. After copper infiltration, chemical copper etching is applied to remove excess surface copper. A machining allowance with an absolute value >0-≦0.1 mm may be applied for the machining of uneven surfaces resulting from the chemical process of copper removal.

REFERENCES:
patent: 4710223 (1987-12-01), Matejczyk
R.S. Khandpur, Printed Circuit Boards, Tata McGraw-Hill, published 2005, Chapter 9, pp. 365-368 and 378-379.
O. Cakir et al. Chemical ethcing of Cu-ETP copper, Journal of Materials Processing Technology, 162-163 (2005), pp. 275-279.

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