Process for making capacitors

Details Process for making capacitors Process for making capacitors

1988-05-06

1990-04-03

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29 2542, 361306, H01G 114, H01G 700, H05K 104

Patent

active

049145479

ABSTRACT:
An epoxy-encased wound capacitor suitable for being surface mounted and wave soldered to electronic circuitry, e.g. circuit boards and process for making the epoxy-encased wound capacitor. The wound capacitor is formed from winding together lengths of two bilaminar ribbons. The capacitor is then cured by exposing it to ultrasonic energy according to a predefined ultrasonic profile while at substantially the same time, mechanically pressing the capacitor. Contacts are formed on the capacitor and wire leads attached. Subsequently, the capacitor is placed in a flexible, reusable plastic mold featuring lead guides for precisely spacing the leads of the capacitor. Bubble-free epoxy is poured in the molds and heat cured. The epoxy-encased capacitor, suitable for surface mounting and wave soldering, is then removed from the mold.

REFERENCES:
patent: 2057314 (1936-10-01), Robinson
patent: 2995688 (1961-08-01), Rosenberg
patent: 3086149 (1963-04-01), Baron
patent: 3156854 (1964-11-01), Beyer
patent: 3436610 (1969-04-01), Sparrow et al.
patent: 3585468 (1971-06-01), Chertok et al.
patent: 3612957 (1971-10-01), Steigerwald
patent: 3806766 (1974-04-01), Fanning
patent: 4034180 (1977-07-01), Kobayashi et al.
patent: 4039905 (1977-08-01), Pearce
patent: 4205365 (1980-05-01), Kalina
patent: 4363162 (1982-12-01), Price
patent: 4654751 (1987-03-01), Tokura et al.

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