Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-11-14
2006-11-14
Weiss, Howard (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
Reexamination Certificate
active
07135357
ABSTRACT:
An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
REFERENCES:
patent: 4381966 (1983-05-01), Rasekhi et al.
patent: 4767674 (1988-08-01), Shirai et al.
patent: 5168348 (1992-12-01), Chu et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5483098 (1996-01-01), Joiner, Jr.
patent: 5825087 (1998-10-01), Iruvanti et al.
patent: 5986888 (1999-11-01), Amaro et al.
patent: 6160346 (2000-12-01), Vleggaar et al.
patent: 6160828 (2000-12-01), Kozlov et al.
patent: 6174425 (2001-01-01), Simpson et al.
patent: 6355505 (2002-03-01), Maeda et al.
patent: 6720203 (2004-04-01), Carcia et al.
patent: 6803257 (2004-10-01), Lee et al.
patent: 2003/0001488 (2003-01-01), Sundahl
patent: 0 842 592 (2001-10-01), None
patent: WO 00/69000 (2000-11-01), None
patent: WO 01/19142 (2001-03-01), None
patent: WO 02/17390 (2002-02-01), None
JP 2001052863, Patent Abstract, Organic EL Element and Manufacture Thereof, Feb. 23, 2001.
JP 2002117972, Patent Abstract, Organic EL Display Device and Its Manufacturing Method, Apr. 19, 2002.
Patent Abstracts of Japan, vol. 1998, No. 09, Jul. 31, 1998, Publ. No. JP 10 108746 A, Pioneer Electron Corp; Tohoku Pioneer KK, Apr. 24, 1998.
Patent Abstracts of Japan, vol. 2003, No. 3, May 5, 2003, Publ. No. JP 2002 343559 A, Rohm Co. Ltd., Nov. 29, 2002.
Patent Abstracts of Japan, vol. 2003, No. 5, May 12, 2003, Publ. No. JP 2003 022891 A, Toshiba Corp., Jan. 24, 2003.
Patent Abstracts of Japan, vol. 2000, No. 12, Jan. 3, 2001, Publ. No. JP 2000 268980 A, Toyota Central Res & Dev Lab Inc., Sep. 29, 2000.
International Search Report, International Appln. No. PCT/US2004/033003, International Filing Date, Oct. 6, 2004, Dupont Co.
Wang Jian
Yu Gang
E. I. du Pont de Nemours and Company
Lamming John H.
Weiss Howard
LandOfFree
Process for making an organic electronic device having a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for making an organic electronic device having a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making an organic electronic device having a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3702700