Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1982-06-28
1984-01-24
Kimlin, Edwards C.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562722, 1562735, 1562733, B05D 306, B21G 702, B65D 8554, F16B 1508
Patent
active
044274785
ABSTRACT:
A process is described for fabricating an encapsulated circuit board. The process involves use of an adhesive which is photochemically curable to a limited preselected depth so as to rigidly fix the circuit wires in X and Y directions while permitting limited pliability of the adhesive and hence mobility of the wires in the Z direction. The adhesive preferably is one which is also thermally curable so that at a later stage of fabrication (e.g., either as a part of or after lamination of individual circuit boards into a multilayered circuit board), the complete unit may be thermally bulk cured to rigidly fix all wires in the Z direction.
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Grant Barbara D.
Jones Carol R.
Cashion Merrell
International Business Machines - Corporation
Kimlin Edwards C.
Otto, Jr. Henry E.
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