Process for making an electrical interconnect structure

Details Process for making an electrical interconnect structure Process for making an electrical interconnect structure

1993-12-06

1998-09-08

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29837, 29839, 29843, 29845, 2281801, 385 92, 439 77, 439 79, H05K 1304, H05K 334

Patent

active

058027114

ABSTRACT:
An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes. More generally, the soldering bridge of the invention is useful for mass soldering of any flexible or rigid circuit board in which leads are to be inserted into substantially larger passages or passages are to be very closely spaced.

REFERENCES:
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patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4658104 (1987-04-01), Koizumi et al.
patent: 4970624 (1990-11-01), Arneson et al.
patent: 5005939 (1991-04-01), Arvanitakin et al.
patent: 5070604 (1991-12-01), Banba et al.
patent: 5295214 (1994-03-01), Card et al.
patent: 5632630 (1997-05-01), Card et al.
patent: 5663526 (1997-09-01), Card et al.

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