Process for making a tantalum capacitor chip

Metal working – Barrier layer or semiconductor device making – Barrier layer device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01G 915

Patent

active

056675364

ABSTRACT:
A process is provided for making a tantalum capacitor chip which includes a tantalum chip body as well as an anode wire partially inserted into and partially projecting from the chip body. The process comprises the steps of compacting an initial divided amount of tantalum powder into an initial mass portion which is dimensionally smaller than the chip body, and compacting at least one additional divided amount of tantalum powder with the initial mass portion into the chip body. The capacitor chip thus obtained may be enclosed in a resin package to provide a surface mounting type tantalum capacitor.

REFERENCES:
patent: 3818286 (1974-06-01), Gauz
patent: 3818581 (1974-06-01), Vartanian et al.
patent: 4520430 (1985-05-01), Long et al.
patent: 4791532 (1988-12-01), Gouvernelle et al.
patent: 4791539 (1988-12-01), Gouvernelle et al.
patent: 4945452 (1990-07-01), Sturmer et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for making a tantalum capacitor chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for making a tantalum capacitor chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making a tantalum capacitor chip will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-214823

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.