Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Patent
1995-11-14
1997-09-16
Niebling, John
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
H01G 915
Patent
active
056675364
ABSTRACT:
A process is provided for making a tantalum capacitor chip which includes a tantalum chip body as well as an anode wire partially inserted into and partially projecting from the chip body. The process comprises the steps of compacting an initial divided amount of tantalum powder into an initial mass portion which is dimensionally smaller than the chip body, and compacting at least one additional divided amount of tantalum powder with the initial mass portion into the chip body. The capacitor chip thus obtained may be enclosed in a resin package to provide a surface mounting type tantalum capacitor.
REFERENCES:
patent: 3818286 (1974-06-01), Gauz
patent: 3818581 (1974-06-01), Vartanian et al.
patent: 4520430 (1985-05-01), Long et al.
patent: 4791532 (1988-12-01), Gouvernelle et al.
patent: 4791539 (1988-12-01), Gouvernelle et al.
patent: 4945452 (1990-07-01), Sturmer et al.
Bilodeau Thomas G.
Eilberg William H.
Niebling John
Rohm & Co., Ltd.
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