Process for making a probe for high speed integrated circuits

Details Process for making a probe for high speed integrated circuits Process for making a probe for high speed integrated circuits

1984-11-19

1986-01-28

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29588, 26427215, 324158P, H05K 334

Patent

active

045661847

ABSTRACT:
A miniaturized probe is provided for making contact with test probe pads on an integrated circuit. The probe tips are precisely positioned on the underside of a microwave substrate board. Short wires extend through a hole in the insulating board and connect the probe tips to a conductive line on the topside of the microwave substrate board. The wires are imbedded in a potting compound which also holds the probe tips. Precise location of the probe tips is accomplished during fabrication of the probe by using depressions etched in a substrate as a mold and depositing metal in these depressions using photoresist and deposition techniques.

REFERENCES:
patent: 3484534 (1969-12-01), Kilby et al.
patent: 3702439 (1972-11-01), McGahey et al.
patent: 3731191 (1973-05-01), Bullard et al.
patent: 3832632 (1974-08-01), Ardezzone
patent: 3911361 (1975-10-01), Bove et al.
patent: 3952410 (1976-04-01), Garretson et al.

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