Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2008-07-17
2010-11-30
Nguyen, Khanh (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S247000, C156S268000, C156S250000, C156S251000, C156S257000, C156S260000, C156S263000, C156S265000, C156S266000, C156S258000
Reexamination Certificate
active
07842155
ABSTRACT:
A method of producing a laminated label structure that includes a region that is markable after assembly of the label structure is disclosed. The method comprises providing a strip of base material having a front face, applying a release material to a markable region of the front face for being marked after assembly of the label structure, and cutting the base material to form a first portion of a perimeter of the label structure. The method further comprises positioning a laminate material over a portion of the front face including the markable region, cutting the base material and the laminate material to form a second portion of the perimeter, cutting the laminate material substantially along a margin of the markable region without severing the base material; and peeling away from the base material a portion of the laminate material overlying the markable region of the front face.
REFERENCES:
patent: 3971866 (1976-07-01), Johnson
patent: 4609589 (1986-09-01), Hosoda et al.
patent: 4621837 (1986-11-01), Mack
patent: 4930812 (1990-06-01), Howard
patent: 4991878 (1991-02-01), Cowan et al.
patent: 5021273 (1991-06-01), Kobayashi
patent: 5074595 (1991-12-01), Hill et al.
patent: D327709 (1992-07-01), Hagen
patent: 5154956 (1992-10-01), Fradrich
patent: 5200243 (1993-04-01), Van Veen
patent: 5234735 (1993-08-01), Baker et al.
patent: 5263743 (1993-11-01), Jones
patent: 5290616 (1994-03-01), Cowan et al.
patent: 5324559 (1994-06-01), Brombacher
patent: 5399403 (1995-03-01), Instance
patent: 5403636 (1995-04-01), Crum
patent: 5439721 (1995-08-01), Pedroli et al.
patent: 5507901 (1996-04-01), Limina et al.
patent: 5587222 (1996-12-01), Hoffmann
patent: 5588239 (1996-12-01), Anderson
patent: 5674334 (1997-10-01), Instance
patent: 5736212 (1998-04-01), Fischer
patent: 5738382 (1998-04-01), Grosskopf et al.
patent: 5804271 (1998-09-01), Barry
patent: 5863628 (1999-01-01), Barry
patent: 5866219 (1999-02-01), McClure et al.
patent: 5951054 (1999-09-01), Hagen et al.
patent: 5972455 (1999-10-01), Barry
patent: 6027598 (2000-02-01), Anderson
patent: 6027780 (2000-02-01), Treleaven et al.
patent: 6057019 (2000-05-01), Barry
patent: 6120637 (2000-09-01), Barry
patent: 6210767 (2001-04-01), Knauf
patent: 6213520 (2001-04-01), Treleaven et al.
patent: 6254137 (2001-07-01), Baum et al.
patent: 6306476 (2001-10-01), Barry
patent: 6329034 (2001-12-01), Pendry et al.
patent: 6398263 (2002-06-01), Treleaven et al.
patent: 6413345 (2002-07-01), Treleaven
patent: 6432500 (2002-08-01), Jones et al.
patent: 6439614 (2002-08-01), Cowan
patent: 6447862 (2002-09-01), Rankin et al.
patent: 6531023 (2003-03-01), Barry
patent: 6541090 (2003-04-01), Grosskopf et al.
patent: 6645592 (2003-11-01), Cowan
patent: 7077435 (2006-07-01), Cowan
patent: 7179514 (2007-02-01), Olsen et al.
patent: 2001/0004152 (2001-06-01), Treleaven et al.
patent: 2001/0011821 (2001-08-01), Lind
patent: 2006/0263594 (2006-11-01), Kraft et al.
patent: 0506202 (1992-09-01), None
patent: 0833295 (1997-09-01), None
patent: 2220886 (1990-01-01), None
patent: WO 92/04704 (1992-03-01), None
patent: WO 98/07131 (1998-02-01), None
Hoover Matthew
Nguyen Khanh
Proehl Jeffrey A.
Woods Fuller Shultz & Smith PC
LandOfFree
Process for making a post-assembly markable label does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for making a post-assembly markable label, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for making a post-assembly markable label will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4169955