Process for making a negative resistance diode utilizing spike d

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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148 15, 148 335, 357 13, 357 15, 357 89, 357 90, 427 84, H01L 21205, H01L 2990

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042016045

ABSTRACT:
A modified Read-type diode having an extremely thin doping spike and with the electric field in the drift region terminated before the buffer zone. The buffer zone and a drift region are first grown upon a doped semiconductor substrate using epitaxial vapor deposition growth techniques employing a furnace tube within a multiple temperature zone reaction furnace. The doping spike is produced by injecting under pressure a fixed predetermined volume of dopant into the furnace tube. An avalanche region is grown over the doping spike and a Schottky barrier contact or semiconducting material of the opposite conductivity type grown over the avalanche region. Avalanche regions having a length less than 15% of the total active length of the device and doping spikes having a width of 500 A or less are disclosed in a high-efficiency device.

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patent: 3906540 (1975-09-01), Hollins
Schroeder et al., "Avalanche Region Width . . . Impatt Diodes", Proc. IEEE, vol. 59, No. 8, Aug. 1971, p. 1245-1248.
Sze et al., "Microwave Avalanche Diodes" Proc. IEEE, vol. 59, No. 8, Aug. 1971, pp. 1140-1154.
Salmer et al., "Theoretical . . . GaAs Impatt . . . Efficiency", J. Applied Physics, vol. 44, No. 1, Jan. 1973, pp. 314-324.

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