Process for making a multilayer circuit board

Details Process for making a multilayer circuit board Process for making a multilayer circuit board

2011-01-25

2011-01-25

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S840000, C029S846000, C029S852000, C427S097100, C427S097200

Reexamination Certificate

active

07874065

ABSTRACT:
A process for making a multi-layered circuit board having electrical current traces includes providing a substrate having a 1stlayer of conductive material to form a ground plane, plurality of metallic 1sttraces on a 2ndside of the substrate having widths of approximately 25 microns or less, developing 1stribs of photoresist forming 1stwalls rising above upper surface of an adjacent seed layer trace, depositing 1stconductive signal traces having a thickness exceeding 25 microns into channels and over seed layer traces and stripping the ribs to leave 1stconductive traces having a height-to-transverse ratio exceeding 1.

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